3D IC and 2.5D IC Packaging Market Key Players, Packaging Technology, Size, Share, Demands and Forecasts to 2028

3D IC and 2.5D IC packaging are advanced packaging technologies that enable the integration of multiple layers of semiconductor devices in a single package, resulting in higher performance, increased functionality, and reduced power consumption.

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The 3D IC and 2.5D IC packaging market is projected to reach USD 82.0 billion by 2028 from USD 49.3 billion in 2023, at a CAGR of 10.7% from 2023 to 2028. The major factors driving the market growth of the 3D IC and 2.5D IC packaging market include rising trend of increased integration density and miniaturization of electronic devices and growing demand for consumer electronics and gaming devices.

The major players of 3D IC and 2.5D IC packaging market are Samsung (South Korea), Taiwan Semiconductor Manufacturing Company, Ltd. (Taiwan), Intel Corporation (US), ASE Technology Holding Co., Ltd. (Taiwan), Amkor Technology (US) among others.

The 3D IC packaging market is expected to grow significantly in the coming years, driven by the increasing demand for compact and high-performance electronic devices. This market includes a wide range of products, such as 3D stacked memory, logic, and imaging devices.

The 2.5D IC packaging market is also expected to experience strong growth in the coming years, as it offers several benefits over traditional 2D packaging, such as reduced power consumption and increased bandwidth. This market includes products such as high-speed interconnects, memory stacks, and system-in-package (SiP) solutions. The key players in this market include Amkor Technology Inc., ASE Group, and TDK Corporation.

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Both 3D IC and 2.5D IC packaging technologies are widely used in various applications, such as data centers, smartphones, and automotive electronics. The increasing demand for high-performance computing, artificial intelligence, and Internet of Things (IoT) devices is expected to drive the growth of both markets in the coming years.

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