Press release
Wire Bonding Market Demand, Research Insights by 2031
According to Transparency Market Research's latest research report on the global wire bonding market for the historical period of 2017-2019 and the forecast period from 2021 to 2031, rising adoption of wire bonding for automotive ICs and increasing demand for MEMS and optoelectronics are expected to boost the global wire bonding market during the forecast period
Get PDF sample for Industrial Insights and business Intelligence @ https://www.transparencymarketresearch.com/sample/sample.php?flag=S&rep_id=83786
MEMS has been known as the revolutionary technology of 21st Century for industrial and consumer products, which deploy silicon-based microelectronics with micromachining technology
MEMS are miniaturized mechanical and electro-mechanical devices that can vary in size from below one micron to several millimeters. They can be magnetometers, microphones, gyrometers, or different types of sensors such as humidity, temperature, and pressure sensors.
Rapid increase in miniaturization trend in electronic systems has led to the popularity of wire bonding of electronic assemblies. For this purpose, fine and ultrafine bonding wires of gold, aluminum, copper, and palladium are extensively required.
Based on chemical composition and wire properties, the bonding wires are adapted to the ceramic/metal MEMS packaging by using automatic bonding machines
Ultrasonic Al wire bonding and thermosonic Au ball bonding are major technologies in optoelectronic manufacturing such as photo patterned thick film package, LTCC packages (low temperature co-fired ceramic), direct bonded copper, and thin film substrate packages
Get a Customized Research Report @ https://www.transparencymarketresearch.com/sample/sample.php?flag=CR&rep_id=83786
This, in turn, is expected to fuel the demand for wire bonding across the globe over the next few years
However, rise in demand for flip chip packaging technology may hamper the market. Flip-chip assembly and wire bonding are the two major processes used for interconnecting ICs. Both the methods have advantages in certain types of applications. Rising consumer demand for high-speed and high-performance package design can be fulfilled by flip chip packaging, which offers various benefits as compared to that offered by traditional wire-bond packaging, such as superior thermal and electrical performance, and smaller device footprint. It also offers processing advantages, such as shorter assembly cycle times, fewer operations, and higher throughput, which can overcome chip shortage.
Rising Adoption of Wire Bonding for Automotive ICs
Increasing usage of wire bonding and rising demand for electrical vehicles in the automotive industry in emerging countries such as China and India are expected to drive the global wire bonding market over the next few years
Automotive ICs should work safely with high reliability for long running of engine; also in harsh working environments such as high temperatures and high humidity. Gold bonding wires can offer higher reliability in such situations to send and receive electrical signals.
Fine gold wires in the range of 15 to 40μm wire diameter are suitable for the electric connection between aluminum electrodes and the internal terminals of automotive ICs
Nexcharge, a joint venture between Exide Industries Ltd. and Leclanche SA, has been using wire bonding technology to connect cells in its Li-ion battery packs. Moreover, all battery packs in Tesla cars utilize the wire bonding technology to manufacture their battery pack.
NSC and its subsidiary, named Nippon Micrometal, has been developing and producing high reliability gold bonding wires that can be used for the improvement of high-temperature reliability of automotive ICs
Advanced Semiconductor Engineering (ASE) and chipmaker Infineon Technologies are also using copper wire bonding in their automotive products
Thus, this factor is projected to have a highly positive impact on the global wire bonding market during the forecast period
View Report @ https://www.transparencymarketresearch.com/wire-bonding-market.html
Wire Bonding Market: Competition Landscape
Detailed profiles of providers of wire bonding have been provided in the report to evaluate their financials, key product offerings, recent developments, and strategies
Key players operating in the global wire bonding market are
Cirexx International Inc.
Powertech Technology Inc.
Alter Technology
Würth Elektronik GmbH & Co. KG
QP Technologies
Tektronix, Inc.
NEOTech Inc.
SMART Microsystems Ltd.
JCET Group Co., Ltd.
Corintech Ltd.
Amkor Technology, Inc.
ASE Technology Holding Co., Ltd.
About Transparency Market Research
Transparency Market Research registered at Wilmington, Delaware, United States, is a global market research firm that offers market analysis reports and business consulting. Our exclusive blend of quantitative forecasting and trends analysis provides forward-looking insights for thousands of decision makers. Our experienced team of Analysts, Researchers, and Consultants use proprietary data sources and various tools & techniques to gather and analyze information.
Our data repository is continuously updated and revised by a team of research experts, so that it always reflects the latest trends and information. With a broad research and analysis capability, Transparency Market Research employs rigorous primary and secondary research techniques in developing distinctive data sets and research material for business reports
For More Research Insights on Leading Industries, Visit our YouTube channel -
https://www.youtube.com/channel/UC8e-z-g23-TdDMuODiL8BKQ
Contact Us:
Rohit Bhisey
Transparency Market Research Inc.
CORPORATE HEADQUARTER DOWNTOWN,
1000 N. West Street,
Suite 1200, Wilmington, Delaware 19801 USA
Tel: +1-518-618-1030
USA - Canada Toll Free: 866-552-3453
Website: https://www.transparencymarketresearch.com
Blog: https://tmrblog.com
Email: sales@transparencymarketresearch.com
Website: http://www.transparencymarketresearch.com
Get PDF sample for Industrial Insights and business Intelligence @ https://www.transparencymarketresearch.com/sample/sample.php?flag=S&rep_id=83786
MEMS has been known as the revolutionary technology of 21st Century for industrial and consumer products, which deploy silicon-based microelectronics with micromachining technology
MEMS are miniaturized mechanical and electro-mechanical devices that can vary in size from below one micron to several millimeters. They can be magnetometers, microphones, gyrometers, or different types of sensors such as humidity, temperature, and pressure sensors.
Rapid increase in miniaturization trend in electronic systems has led to the popularity of wire bonding of electronic assemblies. For this purpose, fine and ultrafine bonding wires of gold, aluminum, copper, and palladium are extensively required.
Based on chemical composition and wire properties, the bonding wires are adapted to the ceramic/metal MEMS packaging by using automatic bonding machines
Ultrasonic Al wire bonding and thermosonic Au ball bonding are major technologies in optoelectronic manufacturing such as photo patterned thick film package, LTCC packages (low temperature co-fired ceramic), direct bonded copper, and thin film substrate packages
Get a Customized Research Report @ https://www.transparencymarketresearch.com/sample/sample.php?flag=CR&rep_id=83786
This, in turn, is expected to fuel the demand for wire bonding across the globe over the next few years
However, rise in demand for flip chip packaging technology may hamper the market. Flip-chip assembly and wire bonding are the two major processes used for interconnecting ICs. Both the methods have advantages in certain types of applications. Rising consumer demand for high-speed and high-performance package design can be fulfilled by flip chip packaging, which offers various benefits as compared to that offered by traditional wire-bond packaging, such as superior thermal and electrical performance, and smaller device footprint. It also offers processing advantages, such as shorter assembly cycle times, fewer operations, and higher throughput, which can overcome chip shortage.
Rising Adoption of Wire Bonding for Automotive ICs
Increasing usage of wire bonding and rising demand for electrical vehicles in the automotive industry in emerging countries such as China and India are expected to drive the global wire bonding market over the next few years
Automotive ICs should work safely with high reliability for long running of engine; also in harsh working environments such as high temperatures and high humidity. Gold bonding wires can offer higher reliability in such situations to send and receive electrical signals.
Fine gold wires in the range of 15 to 40μm wire diameter are suitable for the electric connection between aluminum electrodes and the internal terminals of automotive ICs
Nexcharge, a joint venture between Exide Industries Ltd. and Leclanche SA, has been using wire bonding technology to connect cells in its Li-ion battery packs. Moreover, all battery packs in Tesla cars utilize the wire bonding technology to manufacture their battery pack.
NSC and its subsidiary, named Nippon Micrometal, has been developing and producing high reliability gold bonding wires that can be used for the improvement of high-temperature reliability of automotive ICs
Advanced Semiconductor Engineering (ASE) and chipmaker Infineon Technologies are also using copper wire bonding in their automotive products
Thus, this factor is projected to have a highly positive impact on the global wire bonding market during the forecast period
View Report @ https://www.transparencymarketresearch.com/wire-bonding-market.html
Wire Bonding Market: Competition Landscape
Detailed profiles of providers of wire bonding have been provided in the report to evaluate their financials, key product offerings, recent developments, and strategies
Key players operating in the global wire bonding market are
Cirexx International Inc.
Powertech Technology Inc.
Alter Technology
Würth Elektronik GmbH & Co. KG
QP Technologies
Tektronix, Inc.
NEOTech Inc.
SMART Microsystems Ltd.
JCET Group Co., Ltd.
Corintech Ltd.
Amkor Technology, Inc.
ASE Technology Holding Co., Ltd.
About Transparency Market Research
Transparency Market Research registered at Wilmington, Delaware, United States, is a global market research firm that offers market analysis reports and business consulting. Our exclusive blend of quantitative forecasting and trends analysis provides forward-looking insights for thousands of decision makers. Our experienced team of Analysts, Researchers, and Consultants use proprietary data sources and various tools & techniques to gather and analyze information.
Our data repository is continuously updated and revised by a team of research experts, so that it always reflects the latest trends and information. With a broad research and analysis capability, Transparency Market Research employs rigorous primary and secondary research techniques in developing distinctive data sets and research material for business reports
For More Research Insights on Leading Industries, Visit our YouTube channel -
https://www.youtube.com/channel/UC8e-z-g23-TdDMuODiL8BKQ
Contact Us:
Rohit Bhisey
Transparency Market Research Inc.
CORPORATE HEADQUARTER DOWNTOWN,
1000 N. West Street,
Suite 1200, Wilmington, Delaware 19801 USA
Tel: +1-518-618-1030
USA - Canada Toll Free: 866-552-3453
Website: https://www.transparencymarketresearch.com
Blog: https://tmrblog.com
Email: sales@transparencymarketresearch.com
Website: http://www.transparencymarketresearch.com
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